HomeFacilitiesInstrumentsMicroMech Wafering Machine

MicroMech Wafering Machine

20081021142817_wafer_ok.jpg-thumbBard Hall B55

Precision wafering/dicing machine with 3″, 4″, and 6″ diamond wafering blades. Table has a power feed with a 5″x 10″ magnetic chuck. Cutting is done under a water coolant mixture.

For rates information, please see the rates page.
Primary Contact

Philip Carubia
607/255-6757
pmc228@cornell.edu
Bard Hall, Room B-57
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