HomeFacilitiesInstrumentsAremco Wafer cutting Diamond Saw

Aremco Wafer cutting Diamond Saw

Duffield Hall

is a compact, semi-automatic cutting system for substrates up to 4″ x 4″ x 3/4″ thick. It comes equipped with a 5,000 rpm speed spindle, a manual indexing Y-stage with an air/oil in-feed for maintaining smooth, precise stage control. Parts are mounted with a pneumatic vise or vacuum chuck to a 360° theta stage for part alignment and a monocular microscope for cut alignment.

For rates information, please see the rates page.
Primary Contact

John Grazul
(607) 255-4130
jlg98@cornell.edu
Duffield Hall, Room 150
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